1.Fixed compression stroke

2.Low pin counts(< 200 Pins)

3.Simple structure

4.Cheaper

4.Suit for QFN and QFP package

1.Flexible compression stroke

2.Complex structure

3.More expensive

4.Suit for all kind of package

1.With heat sink

2.Applied for High power IC 

(Heating temperature from 80℃ to 200℃)

1.With extra cooling fan

2.Applied for High power IC 

(Heating temperature above 200℃)